Intel Core Chips Binned By Defects

The difference between Intel Core i3, i5, i7, and i9 chips often comes down to how many of the tiny circuits on a wafer survive manufacturing without defects, a process called product binning. In fabrication plants, Intel prints many processor dies on a single silicon wafer and then tests each one to see which have all their parts working correctly and can run at higher speeds. The best-performing dies are placed into higher product bins, ending up as Core i7 or Core i9 models, while those with small defects or lower stable speeds are sold as Core i3 or Core i5.

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